Method of fabricating semiconductor device



June 11, 1968 F. P. HEIMAN 3,387,358

METHOD OF FABRICATNG SEMICONDUCTOR DEVICE Original Filed Sept. 7, 1962 5 Sheets-Sheet 1 Vd i? lfra/mfy Jum; 11, 1968 F. P. HEIMAN 8,887,358

METHOD OF FABRICATING SEMICONDUCTOR DEVICE Original Filed Sept. '7, 1962 5 Sheets-Sheet t3 .94 a /a fia Il @54, "7'

June 11, -1968 F. P. HEIMAN 3,387,358

METHOD OF FABRICATNG SEMICONDUCTOR DEVICE Original Filed Sept. 7, 1962 5 Sheets-Sheet 5 United States Patent O 3,387,358 METHD 0F FAERECATING SEMICONDUCTOR DEVICE Frederic P. Heman, Cranbury, NJ., assigner to Radio Corporation of America, a corporation of Delaware Gn'ginal application Sept. 7, 1962, Ser. No. 222,019. Divided and this application Nov. 7, 1966, Ser. No. 592,581

i Claims. (Cl. 29571) ABSTRACT 0F THE DISCLSURE A silicon insulated gate field-effect transistor is fabricated by:

(l) Depositing relatively thick, heavily N-doped pyrolytic silicon dioxide on the surface of a silicon wafer only over the areas which are to be the source and drain regions of the device;

(2) Heating the wafer in dry oxygen to cause diffusion of doping impurities from the oxide into the silicon wafer to form the source and drain regions and at the same time to cause thermal oxidation of the exposed surface areas so as to provide a relatively thin gate insulator and a channel in the device; and

(3) Forming contact openings in the deposited oxide and applying source, drain and gate metallization. The gate metal may overlap the deposited oxide over the source and drain.

Related application This application is a division of my copending application, Ser. No. 222,019, filed Sept. 7, 1962, now abandoned.

Brief description of the invention This invention relates to and has as one of its objects the provision of an improved method of fabricating insulated gate eld-eifect transistors.

An insulated gate field-effect transistor comprises a channel of low resistivity semiconductor material and two spaced electrical contacts to the channel, which are referred to as the source and the drain respectively. An insulated gate field-effect transistor includes also a gate electrode adjacent and insulated from the channel. When a drain voltage is applied across the source and drain, a drain current flows through the channel. 'Ihe magnitude of the drain current is a function of the drain voltage and of the number of free charge carriers in the channel. The number of free charge carriers in the channel may be modulated by a gate voltage applied to the gate electrode. This modulation is usually a variable reduction in the number of free charge carriers in the channel resulting in a variable reduction in drain current. Such modulation is referred to as the depletion mode of operation. In certain structures, the modulation may be a variable increase in the number of free charge carriers in the channel resulting in a variable increase in drain current. Such modulation is referred to as the enhancement mode of operation.

A field-eifect transistor made by this method comprises a body of high resistivity semiconductor material, preferably single crystal silicon. The body has a chemicallyreacted region thereon which includes a high resistivity layer of converted body material, preferably an oxide layer, and a low resistivity channel between the layer of converted body material and the bulk of the body. There is a source and a drain connected to the ends of the channel, and a gate electrode on the layer of converted body material opposite the channel.

This transistor is capable of operation in either or both the depletion and enhancement modes of operation. The transfer characteristic of the device is continuous over a relatively large range of gate voltages, and the drain current for zero gate voltage can be tailored over a swbstantial current range by simple changes in the method of fabrication.

The novel method of fabrication of this transistor comprises producing at least two spaced deposited insulating layer portions on the surface of a high resistivity semiconductor body. The deposited layer portions contain impurities which impart conductivity of a particular type to the body. A chemically-reacted region is produced in an exposed surface of the body, as by heating the silicon body in an oxidizing atmosphere. The reacted region includes a high resistivity layer of converted body material and a low resistivity channel between 'the layer of converted body material and the bull'` of the body. During the step of producing the reacted region, impurities diffuse from the deposited layer portions into the body to form in the body low resistivity impurity-diffused regions contiguous with and dening the ends of the channel. The impurity-diffused regions comprise the source and drain of the device. A gate electrode is produced, as by vapor deposition of a metal, on the layer of converted body material opposite and spaced from the channel.

By the method of the invention, the channel, the layer of converted body material, the source, and the drain may all be produced during the same processing step, following only a single masking of the semiconductor body. The characteristics of the device may be modified by a suitable choice of the semiconductor material, its resistivity and its conductivity type; by the selection of the impurity in the deposited layer portions and its concentration; and by the choice of time, temperature, and atmosphere used during the step of producing the reacted region.

An additional feature of the invention may be included in the transistor, if desired, by practicing the process of the invention. It is desirable that the channel length be as short as possible and that the gate electrode be the same effective length as the channel. This may be achieved without the gate electrode being the same actual length as the channel, by producing deposited layer portions Iwhich are substantially thicker than the layer of converted body material, and then producing a gate electrode that extends over the length of the converted layer and also over parts of the deposited layer portions. The effective gate length is that part of the gate electrode which is closest to the channel; that is, the part over the layer of converted body material. The effective gate length does not include the parts of the gate electrode which extend over the deposited layer portions, where there is a substantially greater spacing between the gate electrode and the path of drain current flow.

T he drawings A more detailed description of the invention appears below in conjunction with the drawings in which:

FIGURE 1 is a first embodiment of an insulated gate field-effect transistor made by this method having a circular or ring geometry and a typical circuit for operating the transistor,

FIGURE 2 is a family of curves illustrating the drain characteristics of the embodiment of FIGURE 1,

FIGURE 3 is a second embodiment of a field-effect transistor made by this method, having a. ladder geometry and a typical circuit for operating the transistor,

FIGURES 4A and 4B and 4C are broken away, partially sectional views of structures illustrating a method for fabricating a third embodiment of a field-effect transis- 3 tor, having a ladder geometry similar to the embodiment of FIGURE 3, but having a different gate electrode design.

FIGURE 5 is a family of curves illustrating the drain characteristics of the third embodiment illustrated in FIGURE 4C,

FIGURE 6 is a family of c-urves illustrating the drain characteristics of a fourth embodiment of a field-effect transistor having a geometry similar to the embodiment illustrated in FIGURE 4C, except that the drain characteristics have been modified by a longer heating in dry oxygen,

FIGURE 7 is a family of curves illustrating the drain characteristics of a fifth embodiment of a field-effect transistor having geometry similar to the embodiment of FIGURE 4C except that the drain characteristics have been modified by a subsequent annealing in dry nitrogen,

FIGURE 8 illustrates a sixth embodiment of a fieldeffect transistor having a modified gate geometry, and

FIGURE 9 is a family of curves illustrating the drain characteristics of the field-effect transistor of FIGURE 8.

Detailed description Similar reference numerals are used for similar elements throughout the drawing.

FIGURE 1 illustrates a first embodiment of a unipolar field-effect transistor 21 having a circular of ring geometry. The transistor 21 comprises a high resistivity body 23 of semi-conductor material. The body 23 may be either single crystal or may be polycrystalline; and may be any one of the semiconductor materials used to prepare transistors in the semiconductor art.

The body 23 includes a reacted region comprising a high resistivity layer 25 of converted body material and a low resistivity channel 27 between the bulk of the body 23 and the high resistivity layer 25 of converted body material. For purposes of illustration, the body 23 in FIGURE 1 is a single crystal body of P-type silicon having a resistivity of about 200' ohm-cm. The high resistivity layer 25 in this embodiment has generally a ring shape and is produced by oxidizing a portion of the surface of the body 23. The high resistivity layer 25 is about 2000 A. thick and consists essentially of pure silicon oxide produced by completely oxidizing silicon of the body 23. The low resistivity channel 27 is produced at the same time as the high resistivity layer 25 and is sometimes referred to as an inversion layer. The channel 27 extends under the entire high resistivity layer 25. The channel 27 is believed to have a low resistivity by virture of the attraction of free charge carriers thereto by opposite charges held within the high resistivity layer 25. A gate electrode 29, preferably of a metal such as aluminum, rests on the high resistivity layer 25 opposite and spaced from the channel 27.

A source 31 connects to the outer periphery of the channel 27. A drain 33 connects to the inner periphery of the channel 27. The length of the channel 27, which is the distance between the outer and inner peripheries of the channel 27, is about 0.005 inch. As illustrated, the source 31 and the drain 33 are regions of the body 23 into which N-type impurities have been diffused to render them conducting. Any other structure which makes a suitable connection to the channel 27 may be used as the source 31 and the drain 33.

A source electrode 35, of a generally ring shape and defined by adjacent deposited insulating portions 39 and 41, overlies and connects to a part of the source 31. A circular drain electrode 37, defined by adjacent deposited insulating portion 43, overlies and contacts a part of the drain connection 33. The source and drain electrodes 35 and 37 are preferably of metal, such as aluminum, and may be produced in the same step and of the same muterial as the gate electrode 29. The deposited insulating portions 39, 41 and 43 are of deposited silicon dioxide about 0.1 to microns thick, and preferably about one micron thick.

FIGURE 1 also illustrates a circuit for operating the transistor 21. In the circuit, the source electrode 35 is connected to a ground 51 by a source lead 53. The gate electrode 23 is connected to a terminal of a source 55 of gate voltage Vg by a gate lead 57, the other terminal of the source 55 of gate voltage being grounded. The drain electrode 37 is connected to a terminal of an adjustable source 59 of drain voltage Vd by a drain lead 61 through a load 63. The other terminal of the source 59 of drain voltage is grounded. Output terminals 65 are connected to the ends of the load 63.

In one mode of operation, the drain voltage Vd is adjusted to a desired value. A gate voltage Vg, which is the input or signal to the transistor, and which may be DC, AC in frequencies up to about mc., or pulses, is provided from the gate voltage source 55, or may be impressed in addition to a `field bias value. Drain current Id, which is the output of the transistor, flows from ground 51, through the drain lead 61 to the drain electrode 37, then from the drain electrode 37 through the drain 33, the channel 27, the source 31 and the source electrode 35, and then from the source electrode 35 through the source lead to the ground 51. The drain current Id is a replica of the gate voltage Vg. The output power may be many times the input power; and the input impedance may be many times the output impedance. Thus, the transistor may be used to translate from a higher impedance input to a lower impedance output, to amplify the input power, or `both to translate and to amplify.

FIGURE 2 is a family of static curves illustrating the drain characteristics (drain current Id plotted against drain voltage Vd) of the transistor and circuit of FIG- URE 1. Each curve was made with the gate voltage Vg held constant at the indicated value in volts and the source electrode 35 connected to ground. Increasing values of drain voltage Vd (in volts) were applied to' the drain and the corresponding drain currents Id (in milliamperes) were measured. The gate input impedance is capacitive at low frequencies. Time constant measurements indicate a leakage resistance in the range of 1014 to 1016 ohms. FIGURE 2 illustrates the drain characteristics of a particular unit. Other units of this geometry may be fabricated which may be used with higher negative gate voltages and/or with positive gate voltages. The maximum usable gate voltage is believed to be about i100 volts for the units of the type illustrated in FIGURE 1 and is limited by the dielectric breakdown strength of the converted layer 25, which is about 5 106 volts/ cm.

FIGURE 3 illustrates a second embodiment of fieldeifect transistor, this transistor having a ladder geometry. The ladder geometry facilitates the interconnection of many devices on a single semiconductor body. In the embodiment of FIGURE 3, the channel 27a is rectangular and is about 0.0005 inch long and is about 0.05 inch wide. The high resistivity layer 25a is of silicon oxide about 2700 A. thick Which was converted from a single crystal body 23a of high resistivity silicon. The deposited insulating layer portions 47 are of deposited silicon dioxide about one micron thick. The round tabs 45 at the ends of the gate electrodes 29a permit simple connection thereto with a thermally-bonded wire. Adjacent gate electrodes 29a are spaced on about 0.010 inch centers. The source electrode 35a of one transistor may function also as the drain electrode for an adjacent transistor. Also, the drain electrode 37a of one transistor may function also as the source electrode for and adjacent transistor.

The field-effect transistor illustrated in FIGURE 3 may be prepared by the processing steps illustrated in FIGURES 4A, 4B and 4C. A single crystal body 23a of silicon having a high resistivity is provided; for example, a wafer of 500 ohm-cm. P-type silicon. A surface of the wafer is cleaned to expose the body material. This may tbe achieved, for example, by etching the surface of the wafer with a chemical etchant to remove all of the disturbed material on the surface. Next, heavily-doped silicon dioxide is deposited as a layer portion 47 on selected areas of the clean surface of the body 23a. For example, this is preferably achieved by depositing a uniform layer of doped silicon dioxide, as by thermal deposition from a doped oxy-silane, and then selectively removing the deposited oxide, as by selective etching using a photoresist technique. The thickness of the deposited oxide is preferably between about l and microns. The deposited oxide layer portions 47 contain a relatively high concentration of impurities (also referred to as a dopant) which are N-type when present in silicon. Such impurities may be for example, antimony, arsenic, or phosphorus. The wafer is now heated at about 950 C. in dry oxygen for about one hour and then cooled. During the heating, the surface portions of the silicon wafer 23a which are not covered with the deposited silicon dioxide layer t7 are converted to silicon dioxide 25a. Such converted material is sometimes referred to as thermally-grown silicon dioxide. The converted material is essentially pure silicon dioxide and has a high resistivity of the order of l018 ohm-cm. A channel of N-type material 27a forms between the layer 25a of silicon oxide and the bulk of the body 23a. During the same heating step, impurities from the deposited oxide layer portions 47 diffuse into the silicon under the deposited oxide layer portions t7 to form diffused regions 31a and 33a, in which the impurities decrease in concentration with the distance from the deposited layer portion 47. At the point of connection to the channel 27a and above, the diffused regions 47 have a relatively low resistivity.

Apertures are now etched through the deposited oxide layer portions i7 permitting access to a central part of the diffused regions 31a and 33a. This may be achieved by applying a photoresist to selected areas of the deposited and of the thermally-grown silicon oxide layers 47 and 25a, and then etching away portions where the holes are desired. Then, metal, such as aluminum, is selectively deposited on central parts of the dilfused regions Sla and 33u, where the apertures were previously etched, and on the layer 25a of converted body material opposite the channel 27a to form the source, drain, and gate electrodes 35a, 37a and 29a respectively. This may be accomplished by depositing, as by vapor deposition, a uniform layer of metal, such as alurrnnum, and then selectively removing the deposited metal using a photoresist technique leaving a source electrode 35a, a gate electrode 29a, and a drain electrode 37a. v

Ordinarily, the gate electrode 29a is coextensive with the layer 25a of converted body material. However, thls construction presents some fabrication diliiculties, especially in aligning the gate electrode 29a over the layer of converted body material 25a. In a third embodiment, the gate electrode 29a is made longer than the channel 27a to extend over parts of the deposited layer portions 47. The gate electrode 29a covers the entire layer 25a of converted material and parts of the deposited oxide layer portions 47. The extended portions ofthe gate electrode 29a are indicated by the numeral 49. Smce the thickness of the deposited oxide layer 47 is at least four times that of the layer 25a of converted material, only a small amount of additional capacitance is thereby added to the device.

FIGURE 5 is a family of curves illustrating the drain characteristics (Id plotted against Vd for different gate voltages Vg) of the transistor of FIGURE 4C. The transconductance is approximately 3,000 micromhos and the input capacitance measured at Zero gate bias is fifteen picofarad, at about one mc. When the channel 27a is completely depleted of free electrons by an applied gate voltage, the channel resistance is about 20,000 ohms. This resistance is believed to be due to a parallel leakage path between the source and drain connections 31a and 33a around the gate electrode 29a.

This unit may be operated at both positive and negative gate voltages Vg. There is substantially no DC gate current with either positive or negative gate voltage. The upward turn of the curves for negative gate voltages at higher drain voltage is the effect of avalanche breakdown in the carrier depleted channel 27a. For example, the curve Vg=3 volts turns upward for values of Vd greater than about +10 volts. Gate current flow does not accompany this phenomenon.

Numerous variations may be made in the processing of the above-described transistors which affect the drain characteristics of the completed transistor. In one variation, the body region which is to be converted is lirst diffused with conductivity determining impurities. While such diffusion has been suggested previously for the purpose of producing a channel, the doping herein is not for the purpose of producing a channel, but is for the purpose of modifying the number of free electrons available in the channel normally formed between the converted layer and the bulk of the body. For this purpose, the density of impurities which are diffused is substantially smaller than previously suggested. The impurities may be of either P-type or N-type and are diffused to a depth and in a concentration just suflicient to modify the drain characteristics of the channel which would be produced with no additional impurity present. The choice of base material 23 is important. The base may be any single crystal or polycrystalline semiconductor material which may be used to prepare semiconductor devices. The base material should have a high resistivity and be capable of producing a high resistivity layer by chemical conversion of a region of the body. The preferred base material is single crystal silicon. Low resistivity P-type silicon is not suitable as the base material because only partial compensation will occur in the channel region and an N-type layer will not be obtained upon producing the converted layer. P-type silicon, typically between 2 and 1000 ohmcm. resistivity, is a preferred base material. Generally, in P-type silicon, the higher the resistivity of the base, the greater the number of free N-type charge carriers in the channel. If a P-type channel is desired between the bulk of the base and the layer of converted body material,

- then high resistivity N-type silicon should be used as the base.

'The drain characteristics of the transistor of FIGURE 4C may also be modified by changing the time in the range between 0.5 and 40 hours and/ or temperature in the range between 850 and 1l00 C. of heating used to produce the converted layer. Longer heating times and higher heating temperatures will convert the silicon of the body to a greater depth, and produce a channel of greater depth. FIGURE 6 is a family of curves of a transistor similar in geometry to that illustrated in FIGURE 4C except that the heating step was continued for about two hours at about 950 C. in dry oxygen. This produced a thicker reacted region including a deeper channel. Also, depending on the atmosphere and of the surface treatment prior to oxidation, either a P-type or an N-type channel (inversion layer) may be formed. Either type of channel is operative. However, the connections to the channel should be of the same conductivity type as that of the channel. Where P-type source and drain connections are desired for silicon, the deposited oxide layer should contain P-type impurities for silicon such as indium or boron. Where N-type source and drain connections are desired for silicon, the deposited oxide layer should contain N-type impurities for silicon, such as arsenic, antimony, or phosphorus.

It has been found that baking the base-` for one or more hours in a dry inert atmosphere after the formation of the converted layer reduces the number of free charge carriers present in the channel. For instance, in the device of FIGURE 4C, the concentration of free charge carriers asas/ass in the channel produced during the heating step can be reduced by subsequently baking the silicon wafer at about 1000 C. for about one hour in dry nitrogen. The overall procedure is the same as that described above with respect to fabricating the device of FIGURE 4C, except that before the electrodes are applied, the assembly is heated in an inert atmosphere and then cooled. FIGURE 7 is a family of curves illustrating the drain characteristic of a transistor prepared by this modified process. The transistor is referred to as an enhancement field-effect transistor because the principal mode of operation is by the further enhancement to the channel of free charge carriers in response to a positive gate voltage, for an N-type channel.

FIGURE 8 is a plan View illustrating a sixth field-effect transistor. The structure is similar to the device of FIG- URE 3 except that adjacent gate electrodes are connected at both ends so that the drain electrode of each unit is completely surrounded by a modified gate electrode. As

illustrated in FIGURE 8, each unit is comprised of two source electrodes 33b and a drain electrode 37b enclosed by the gate electrode 29a. In this embodiment, the drain electrode of one unit is not intended to function as a source electrode for an adjacent unit.

FIGURE 9 is a family of curves illustrating the drain characteristics of the unipolar held-effect transistor illustrated in FIGURE 8. The device may be operated in either the depletion mode or the enhancement mode (positive gate voltage), The transistor having the moditied gate electrode has a lower leakage current than the transistor having the ladder geometry. This results from the fact that the drain electrode is completely surrounded by the gate electrode.

What is claimed is: 1. A method for fabricating a semiconductor device comprising producing at least two spaced deposited insulating layer portions on a surface of a high resistivity silicon semiconductor body, said layer portions containing impurities of one conductivity type for said silicon body,

heating said body in an oxidizing atmosphere (a) to produce a reacted region in said body between said deposited layer portions, said reacted region comprising a high resistivity layer of converted body material and a low resistivity channel between the bulk of said body and said layer of converted body material and (b) to cause impurities to diffuse from said deposited layer portions into said body to form low resistivity diffused regions in said body contiguous with and defining the ends of said channel, and then producing an electrode on said layer of converted body material opposite and spaced from said channel.

2. A method for fabricating a eldeffect transistor comprising depositing a layer of silicon dioxide on a surface of a high resistivity silicon semiconductor body, said deposited layer containing a concentration of N-type impurities for said body,

selectively removing material from said layer leaving at least two spaced deposited layer portions thereof on said body,

heating said body at about 850 to 1l00 C. in an oxidizing atmosphere (a) to produce a reacted region in said body between said deposited layer portions, said reacted region comprising a high resistivity silicon oxide layer of converted body material, and a low resistivity channel between said layer of converted body material and the bulk of said body, and (b) to cause said impurities to diffuse from said deposited layer portions into said body to form low resistivity diffused regions in said body contiguous with and defining the ends of said channel, and

depositing a gate electrode upon said layer of converted body material opposite and spaced from said channel.

3. A method for fabricating a field-effect transistor comprising depositing a layer of silicon dioxide on a surface of a high resistivity single crystal silicon semiconductor body, said deposited layer containing a concentration of N-type impurities for said body,

selectively removing material from said deposited layer leaving at least two spaced deposited layer portions on said body,

heating said body at about 850 to ll00 C. for 0.5 to 40 hours in an oxidizing atmosphere (a) to produce a reacted region in said body between said deposited layer portions, said reacted region comprising a high resistivity silicon oxide layer of converted body material, and a low resistivity channel between said layer of converted body material and the bulk of said body, and (b) to cause said impurities to diffuse from said deposited layer portions into said body thereby forming low resistivity diffused regions in said body contiguous with and defining the ends of said channel,

selectively removing material from each of said deposited layer portions so as to expose each of said diffused regions in said body,

depositing metal contacts to each of said diffused regions, and

depositing a gate electrode upon said layer of converted body material opposite and spaced from said channel.

4. A method for fabricating a field-effect transistor comprising depositing a layer lof silicon dioxide on a surface of a high resistivity single crystal silicon semiconductor body, said deposited layer containing a concentration of N-type impurities for said body,

selectively removing material from said deposited layer leaving at least two spaced deposited layer portions on said body,

heating said body at about 850 to 1100 C. for 0.5 to 40 hours in an oxidizing atmosphere (a) to produce a reacted region in said body between said deposited layer portions, said reacted region comprising a high resistivity silicon oxide layer of converted body material and a low resistivity channel between said layer of converted body material and the bulk of said body, and (b) to cause said impurities to diffuse from said deposited layer portions into said body to form low resistivity diffused regions in said body contiguous with and defining the ends of said channel,

selectively removing material from each of said deposited layer portions so as to expose a surface of each of said diffused regions in said body,

depositing metal contacts to each of said diffused regions at said exposed surfaces and,

depositing a gate electrode upon said layer of converted body material opposite and spaced from said channel and extending over at least a part of the remaining deposited layer portions on said body.

References Cited UNITED STATES PATENTS 3,056,888 10/1962 Atalla. 3,226,611 12/1965 Haenichen 317-234 2,899,344 8/1959 Atalla 14S-1.5 3,102,230 8/1963 Kahny .Z9-155.5 3,200,019 8/1965 Scott 148-188 WILLIAM I. BROOKS, Primary Examiner. 

